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VIKAS TYAGI

VIKAS TYAGI

Subject Matter Expert PCBA SMT & BE Process
Chihuahua, Chihuahua

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Sobre VIKAS TYAGI:

A qualified B. Tech (ECE) with more than 8.5 Years’ experience in SMT Electronics PCBA Manufacturing Engineering/Process Engineering/Product engineering.
• Currently working as Subject Matter Expert for SMT & BE Process with Multiple Projects like Health Care (Sierra, Kronos Etc.), A&T (Ford, Tesla, Rivian, APTIV Etc.).
• Handling new project by developing new supplier and develop systems to meeting Quality requirements.
• Handling new project by developing new supplier and develop systems to meeting Quality requirements.
• Handling the Customer Complain related with PCBA and BE Process and Supplier Development for PCBA
• Knowledge of and understanding of SMT, Wave solder, Pin and Paste, Press Fit & PTH processes.
• Knowledge of and understanding of IPC A- 610 standards.

Experiencia

1. Organization : Jabil Circuit De Chihuahua, Mexico
Duration : October 2022 to Present date.
Designation : SME PCBA (SMT & PCB Assembly)
Key Result Areas:
❖ Lead process qualification and reliability validation for NPI projects and work closely with cross function team and customers to make sure of successful project launch.
❖ Customer process and reliability requirements interpretation and deployment.
❖ Conduct failure analysis for process and reliability test issues.
❖ DFX (DFM, DFR, etc.) analysis in each NPI phase; DFX rules consolidation.
❖ New PCBA manufacturing site assembly technology assessment, qualification, enablement.
❖ Work with cross function teams for continuous improvement of process, quality and efficiency, etc.
❖ Knowledge of and understanding of SMT, Wave solder, Pin and Paste, Press Fit & PTH processes.
❖ · Understanding of complex failure mechanisms in PCBA process and or PCB fabrication and knowledge of standard failure analysis techniques (SEM, EDX, X-section, Die and Pry, CSAM).
❖ Work with cross function teams for continuous improvement of process, quality and efficiency, etc.
❖ Strong background in quality documentation standards and methodologies like APQP, PPAP, Why-Why Analysis, Root Case Analysis, Process Flow Diagram, SMT, Pareto Chart, SPC Etc.
2. Organization: Foxconn, Ciudad Juarez Mexico
Duration: February 2022 to October 2022.
Designation: Process Engineering Leader (SMT & PCB Assembly)
(Process Engineering, New product development, Product Engineering, RCA,).
Key Result Areas: (Process Engineering, NPI, Manufacturing, DOE, DFM, Product Engineering)
❖ Production Engineering: Controlling all New product development. (All activity from development to handover).
❖ Controlling Installation New machine/Process/method as per customer requirement.
❖ Controlling Documents as per IATF 16949.
❖ Review Engineering change orders and updating BOM’s as necessary.
❖ Downloading customer documents like product specifications etc. & releasing same in CDC.
❖ Work as a change analyst during NPI for new process or product changes.
❖ Knowledge in PCBA manufacturing (SMT & BE process).
❖ Use Agile (PLM) system for ECO creation, reviewing, routing, tracking, releasing and distribution.
❖ Conversant with Quality Standard PPAP, APQP,8D, 7QC, documentations.
❖ Strong involvement & validation during NPI, Product Changeovers, ECO implementation, BOM verification.
❖ Study the ECOs / Drawings closely and coordinating with the Program / Product data management team and keeping track of received data and source documents, Also Coordinating the CFT team on the NPI activity.
❖ Works closely with Engineering and materials teams to review product updates /modifications.
❖ Response to Business Partner (requestor) and customer on queries relating to Engineering Change Orders as well as Manufacturing Change Order. Literate in Microsoft software Outlook, Gerber files, Cad files handling.
❖ Knowledge of PFC, PFMEA, PCP, SOP, SOW and statistics used in NPI / Product development process.
3. Organization : NAVITASYS India PVT LTD.
Duration : November 2019 to February 2022
Designation : Sr. Process & Manufacturing Engineering SMT
Key Result Areas: Process Engineering, Manufacturing, Product Engineering, Customer Complained & Scrap Rate Control, PCBA,
Stencil and Tooling Design and Management.
4.
Organization
: Vivo India Pvt. Ltd
Duration
: June 2015 to September 2019
Designation
: GET & Sr. Engineer (SMT-PCBA Process & Production Department).
Key Result Areas: SMT Process & PCBA Manufacturing, Cost Management, SMT DT reduction, Study the ECOs / Drawings
closely and coordinating with the Program / Product data management team and keeping track of
received data and source documents, Also Coordinating the CFT team on the NPI activity.

Educación

❖ Completed B.Tech (Electronics & Communication Engineering) in 2016.
❖ Completed Intermediate (Physics, Chemistry & Mathematics) in 2012.
❖ Completed High School in 2009.
❖ Gate Qualified Two times in 2016 & 2017.

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